- Author rejects selling SK hynix because Samsung sampled hybrid bonding first: sampling enables validation, while product, customer, timing and process requirements remain unclear.
- Samsung is the author’s highest-upside pick because memory, foundry and packaging under one roof could shorten development cycles and give customers more system-optimization options.
- The author expects strong prelims, with DRAM, NAND, memory prices, AI infrastructure and expanding HBM4 supporting results; AMD’s MI455X collaboration and potential foundry work provide evidence of renewed customer engagement.
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