PERSON DIRECTORY
Howie
Howie appears in 3 indexed conversations across SemiAnalysis. This directory brings every appearance, source, TL;DR, digest, and transcript into one searchable feed.
Ep. 040 - ASML Is Building a Hybrid Bonding Tool, and We Have the Patents (AI Supply Chain)
2025 patents point to ASML's unannounced die-to-wafer bonder, several years out, leveraging its metrology and wafer-stage strengths.Logic’s shorter, denser connections offer the clearer efficiency case; HBM’s higher costs and customer requests for fewer layers leave use unlikely before 2029, if at all.Yield still hinges on six-axis alignment, particle control and supplier integration across the conveyor design.
Analog's Mechatronics Engineer: Hardware Powering AI Inference | Researcher Conversations at GTC
Analog Devices’ Emerging Tech Hub is moving its semiconductor signal-chain stack into robotics, with multimodal tactile sensing targeting delicate data-center maintenance such as disconnecting cables and polishing fibers.Open-source physical benchmarks and high-fidelity tactile/time-of-flight simulation aim to narrow the sim-to-real gap, while compact edge inference could broaden deployment; however, collaborations remain unnamed and the work is ongoing.
Ep. 003 - Deep Dive on NVIDIA Vera Rubin VR NVL72 (AI Supply Chain) | Jordan Nanos, Myron Xie, Copper Wei (Wega), Howie
Jordan NanosDoug O'LaughlinMyron XieCopper Wei (Wega)Howie
Rubin’s adaptive compression engine makes sparse FP4 potentially usable, delivering up to 50 PF effective performance from 35 PF dense processing, while HBM4 targets 22 TB/s per chip and may bin suppliers by capability.Cableless compute trays and NVIDIA-controlled SoCAMM procurement address GB200’s yield pain and memory tightness, but 2.3 kW GPUs and a likely 1H27 mass deployment leave ramp hiccups and HBM pricing as risks.